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LQ-MD 30K
UPG
The fully automatic electronic tag packaging machine is a device designed for HF and UHF electronic tag inlay chip patches in the RFID industry of the Internet of things. The whole equipment can meet the use of antennas with a width of 20-180mm (narrow width).
The whole line consists of automatic winding antenna, automatic pulling, automatic dot glue, mounting chip, automatic heat pressure, automatic detection marking, and automatic winding collection.
The device supports both 8-inch and 12-inch wafer discs.
The patch part adopts the camera pair material and chip alignment to meet the requirements of chip mounting accuracy.
Use industrial control machine control, combined with the modular design of imported step motor, cylinder, guide rail and wire rod, to meet the stability requirements of customers for long-time use of equipment.
Each group of thermal pressure head ensures planness of thermal pressure mechanism, and each group of thermal pressure and temperature are adjusted consistent and stable to ensure glue curing effect.
The fully automatic electronic tag packaging machine is a device designed for HF and UHF electronic tag inlay chip patches in the RFID industry of the Internet of things. The whole equipment can meet the use of antennas with a width of 20-180mm (narrow width).
The whole line consists of automatic winding antenna, automatic pulling, automatic dot glue, mounting chip, automatic heat pressure, automatic detection marking, and automatic winding collection.
The device supports both 8-inch and 12-inch wafer discs.
The patch part adopts the camera pair material and chip alignment to meet the requirements of chip mounting accuracy.
Use industrial control machine control, combined with the modular design of imported step motor, cylinder, guide rail and wire rod, to meet the stability requirements of customers for long-time use of equipment.
Each group of thermal pressure head ensures planness of thermal pressure mechanism, and each group of thermal pressure and temperature are adjusted consistent and stable to ensure glue curing effect.
